MIL-STD 750 Semiconductor Component Tests

EUROLAB Laboratory has the expert team and technological equipment to test semiconductor devices according to the MIL-STD 750 standard, including basic environmental tests and physical and electrical tests to determine resistance to the harmful effects of natural elements and conditions surrounding military operations. For the purposes of MIL STD 750, the term "devices" includes items such as transistors, diodes, voltage regulators, rectifiers, tunneling diodes, and other related parts. This standard is intended to apply only to semiconductor devices.

MIL-STD-750(F)establishes uniform methods and procedures for testing semiconductor devices suitable for use in military and aerospace electronic systems. The methods and procedures in the various parts of this standard include basic environmental, physical and electrical tests for determining resistance to the harmful effects of the natural elements and conditions surrounding military and space operations.

Advanced Component Testing has been inspected for Laboratory Compliance by the UAF (UAF) for testing a US Government supplied MIL-SPEC product. EUROLAB is one of the few qualified and approved laboratories for the processing and testing of components and is a conformity assessment body with test accreditation for testing MIL-STD-750 as well as MIL-STD-202 and MIL-STD-883 methods.

Headings according to the standard items;

Environmental tests (1000 series)

MIL-STD-750 Method Number 1001.2 Barometric pressure (low)
MIL-STD-750 Method Number 1011.1 Immersion
MIL-STD-750 Method Number 1015.1 Steady state primary photocurrent irradiation procedure (electron beam)
MIL-STD-750 Method Number 1016 Insulation resistance
MIL-STD-750 Method Number 1017.1 Neutron radiation
MIL-STD-750 Method Number 1018.3 Internal gas analysis
MIL-STD-750 Method Number 1019.5 Steady state total dose irradiation procedure
MIL-STD-750 Method Number 1020.2 Electrostatic discharge sensitivity (ESDS) classification
MIL-STD-750 Method Number 1021.3 Moisture resistance
MIL-STD-750 Method Number 1022.5 Resistance to solvents
MIL-STD-750 Method Number 1026.5 Steady-state operating life
MIL-STD-750 Method Number 1027.3 Steady-state operating life (example plan)
MIL-STD-750 Method Number 1031.5 High temperature life (non-operational)
MIL-STD-750 Method Number 1032.2 High temperature (non-operating) life (sample plan)
MIL-STD-750 Method Number 1033 Reverse voltage leakage stability
MIL-STD-750 Method Number 1036.3 Intermittent operating life
MIL-STD-750 Method Number 1037.2 Intermittent operating life (sample plan)
MIL-STD-750 Method Number 1038.4 Combustion (for diodes, rectifiers, and zeners)
MIL-STD-750 Method Number 1039.4 Combustion (for transistors)
MIL-STD-750 Method Number 1040 Combustion (for thyristors (controlled rectifiers)
MIL-STD-750 Method Number 1041.3 Salt atmosphere (corrosion)
MIL-STD-750 Method Number 1042.3 Combustion and life testing for power MOSFETs or insulated gate bipolar transistors (IGBT)
MIL-STD-750 Method Number 1046.3 Salt spray (corrosion)
MIL-STD-750 Method Number 1048 Preventing Life
MIL-STD-750 Method Number 1049 Blocking life (sample plan)
MIL-STD-750 Method Number 1051.6 Temperature cycling (air to air)
MIL-STD-750 Method Number 1054.1 Potted media stress testing
MIL-STD-750 Method Number 1055.1 Monitored duty temperature cycle
MIL-STD-750 Method Number 1056.7 Thermal shock (liquid to liquid)
MIL-STD-750 Method Number 1057.1 Resistance to glass cracking
MIL-STD-750 Method Number 1061.1 Temperature measurement, casing and stud
MIL-STD-750 Method Number 1066.1 Dew point
MIL-STD-750 Method Number 1071.8 Hermetic seal
MIL-STD-750 Method Number 1080 Single event burnout and single event door break test

Mechanical property tests (2000 series)

MIL-STD-750 Method Number 2005.2 Axial lead pull test
MIL-STD-750 Method Number 2006 Constant acceleration
MIL-STD-750 Method Number 2016.2 Shock
MIL-STD-750 Method Number 2017.2 Mold insertion integrity
MIL-STD-750 Method Number 2026.11 Solderability
MIL-STD-750 Method Number 2031.3 Soldering heat resistance
MIL-STD-750 Method Number 2036.4 Terminal power
MIL-STD-750 Method Number 2037.1 Bond strength
MIL-STD-750 Method Number 2046.2 Vibration fatigue
MIL-STD-750 Method Number 2051.1 Vibration noise
MIL-STD-750 Method Number 2052.4 Particle impact noise detection (PIND) test
MIL-STD-750 Method Number 2056 Vibration, variable frequency
MIL-STD-750 Method Number 2057.2 Vibration, variable frequency (monitored)
MIL-STD-750 Method Number 2066 Physical dimensions
MIL-STD-750 Method Number 2068 External visual for opaque, glass-encased, double-plug, gapless, axial lead diode
MIL-STD-750 Method Number 2069.2 Front cover image, power MOSFETs
MIL-STD-750 Method Number 2070.2 Visual microwave discrete and multi-chip transistors with front cover
MIL-STD-750 Method Number 2071.6 Visual and mechanical inspection
MIL-STD-750 Method Number 2072.6 Internal visual transistor (front cover) inspection
MIL-STD-750 Method Number 2073.1 Internal inspection for mold (semiconductor diode)
MIL-STD-750 Method Number 2074.4 Internal visual inspection (discrete semiconductor diodes)
MIL-STD-750 Method Number 2075.1 Untitle internal visual design verification
MIL-STD-750 Method Number 2076.3 Radiography
MIL-STD-750 Method Number 2077.3 Scanning electron microscope (SEM) investigation of metallization
MIL-STD-750 Method Number 2078 Internal visual for hardwired diodes/rectifiers
MIL-STD-750 Method Number 2081 Forward instability, shock (FIST)
MIL-STD-750 Method Number 2082 Backward instability, jitter (BIST)
MIL-STD-750 Method Number 2101.1 DPA procedures for Diodes
MIL-STD-750 Method Number 2102 DPA for wire-connected devices
MIL-STD-750 Method Number 2103 Design verification for surface mount devices

MIL-STD-750 is periodically revised. Current versions of the standard include MIL-STD-750 F, MIL-STD-750 E, MIL-STD-750 D, MIL-STD-750 C, MIL-STD-750 B, MIL-STD-750 A, MIL. -STD-750/5, MIL-STD-750/4, MIL-STD-750/3, MIL-STD-750/2 and MIL-STD-750/1.