MIL-STD-883 Tests

The MIL-STD-883 standard defines Microcircuit Compatibility Tests. MIL-STD-883 is the military testing standard that establishes uniform methods, controls, and procedures for testing microelectronic devices. 

The purpose of MIL-STD-883 testing is to identify devices suitable for use in military and aerospace electronic systems based on the harmful effects of natural elements and conditions.

The MIL-STD 883 standard defines devices as items such as monolithic, multi-chip, film and hybrid microcircuits, microcircuit arrays, and items from which circuits and arrays are built. This standard is intended to apply only to microelectronic devices.

This military compliance standard has three main purposes. The first is to identify suitable conditions that can be achieved in the laboratory and at the instrument level. These conditions give test results equivalent to actual service conditions available in the field. It is very important to achieve repeatability of test results.

The second goal is to describe in a single standard all test methods of similar character seen in various joint services and NASA microelectronic device specifications. This is a goal to keep these methods uniform. The result is protection of equipment, hours of operation and testing facilities. To achieve this goal, each of the general tests needs to be made adaptable to a wide range of devices.

The end goal is to provide a level of uniformity in physical, electrical and environmental testing; manufacturing controls and workmanship; and materials. This will ensure consistent quality and reliability across all devices scanned against the test standard.

MIL-STD 883 is divided into five series. Below is a summary of all tests and links to additional information for some tests.

Environmental Tests:

• MIL-STD-883 Method Number 1001 Barometric pressure, reduced (altitude operation)
• MIL-STD-883 Method Number 1002 Immersion
• MIL-STD-883 Method Number 1003 Insulation resistance
• MIL-STD-883 Method Number 1004 Moisture resistance
• MIL-STD-883 Method Number 1005 Steady-state life
• MIL-STD-883 Method Number 1006 Intermittent life
• MIL-STD-883 Method Number 1007 Acceptance life
• MIL-STD-883 Method Number 1008 Stabilization furnace
• MIL-STD-883 Method Number 1009 Salt atmosphere (corrosion)
• MIL-STD-883 Method Number 1010 Temperature cycling
• MIL-STD-883 Method Number 1011 Thermal shock
• MIL-STD-883 Method Number 1012 Thermal properties
• MIL-STD-883 Method Number 1013 Dew point
• MIL-STD-883 Method Number 1014 Seal
• MIL-STD-883 Method Number 1015 Combustion test
• MIL-STD-883 Method Number 1016 Life/safety characterization tests
• MIL-STD-883 Method Number 1017 Neutron irradiation
• MIL-STD-883 Method Number 1018 Internal gas analysis
• MIL-STD-883 Method Number 1019 Ionizing radiation (total dose) test procedure
• MIL-STD-883 Method Number 1020 Dose rate induced latching test procedure
• MIL-STD-883 Method Number 1021 Dose rate degradation testing of digital microcircuits
• MIL-STD-883 Method Number 1022 Mosfet threshold voltage
• MIL-STD-883 Method Number 1023 Dose rate response of linear microcircuits
• MIL-STD-883 Method Number 1030 Front seal burn
• MIL-STD-883 Method Number 1031 Thin-film corrosion test
• MIL-STD-883 Method Number 1032 Packet soft error test procedure (due to alpha particles)
• MIL-STD-883 Method Number 1033 Endurance life test
• MIL-STD-883 Method Number 1034 Die penetrant test (for plastic devices)

Mechanical Tests:

• MIL-STD-883 Method Number 2001 Constant acceleration
• MIL-STD-883 Method Number 2002 Mechanical shock
• MIL-STD-883 Method Number 2003 Solderability
• MIL-STD-883 Method Number 2004 Lead integrity
• MIL-STD-883 Method Number 2005 Vibration fatigue
• MIL-STD-883 Method Number 2006 Vibration noise
• MIL-STD-883 Method Number 2007 Vibration, variable frequency
• MIL-STD-883 Method Number 2008 Visual and mechanical
• MIL-STD-883 Method Number 2009 Exterior image
• MIL-STD-883 Method Number 2010 Internal visual (monolithic)
• MIL-STD-883 Method Number 2011 Bond strength (destructive bond pull test)
• MIL-STD-883 Method Number 2012 Radiography
• Internal visual inspection for MIL-STD-883 Method Number 2013 DPA
• MIL-STD-883 Method Number 2014 Internal visual and mechanical
• MIL-STD-883 Method Number 2015 Resistance to solvents
• MIL-STD-883 Method Number 2016 Physical dimensions
• MIL-STD-883 Method Number 2017 Internal visual (hybrid)
• MIL-STD-883 Method Number 2018 Scanning electron microscope (SEM) inspection of metallization
• MIL-STD-883 Method Number 2019 Die shear strength
• MIL-STD-883 Method Number 2020 Particle impact noise detection test
• MIL-STD-883 Method Number 2021 Glassification layer integrity
• MIL-STD-883 Method Number 2022 Wetting level solderability
• MIL-STD-883 Method Number 2023 Non-destructive bond pulling
• MIL-STD-883 Method Number 2024 Lid torque for glass frit sealed packages
• MIL-STD-883 Method Number 2025 Bonding of lead coating
• MIL-STD-883 Method Number 2026 Random vibration
• MIL-STD-883 Method Number 2027 Surface bond strength
• MIL-STD-883 Method Number 2028 Pin grid package destructive lead pull test
• MIL-STD-883 Method Number 2029 Ceramic chip carrier bond strength
• MIL-STD-883 Method Number 2030 Ultrasonic inspection of mold insert
• MIL-STD-883 Method Number 2031 Flip chip pull-off test
• MIL-STD-883 Method Number 2032 Visual inspection of passive elements
• MIL-STD-883 Method Number 2035 Ultrasonic inspection of TAB ligaments
• MIL-STD-883 Method Number 2036 Soldering heat resistance

Electrical tests (digital):

• MIL-STD-883 Method Number 3001 Driver source, dynamic
• MIL-STD-883 Method Number 3002 Load conditions
• MIL-STD-883 Method Number 3003 Latency measurements
• MIL-STD-883 Method Number 3004 Transition time measurements
• MIL-STD-883 Method Number 3005 Power supply current
• MIL-STD-883 Method Number 3006 High level output voltage
• MIL-STD-883 Method Number 3007 Low level output voltage
• MIL-STD-883 Method Number 3008 Breakdown voltage, input or output
• MIL-STD-883 Method Number 3009 Input current, low level
• MIL-STD-883 Method Number 3010 Input current, high level
• MIL-STD-883 Method Number 3011 Output short-circuit current
• MIL-STD-883 Method Number 3012 Terminal capacitance
• MIL-STD-883 Method Number 3013 Noise margin measurements for digital microelectronics
• MIL-STD-883 Method Number 3014 Functional tests
• MIL-STD-883 Method Number 3015 Electrostatic discharge sensitivity classification
• MIL-STD-883 Method Number 3016 Activation time verification
• MIL-STD-883 Method Number 3017 Microelectronics package digital signal transmission
• MIL-STD-883 Method Number 3018 Crosstalk measurements for digital microelectronic device packages
• MIL-STD-883 Method Number 3019 Ground and power supply impedance measurements for digital microelectronic device packages
• MIL-STD-883 Method Number 3020 High impedance (out of state) low level output leakage current
• MIL-STD-883 Method Number 3021 High impedance (out of state) high level output leakage current
• MIL-STD-883 Method Number 3022 Input clamp voltage
• MIL-STD-883 Method Number 3023 Static latching measurements for digital CMOS microelectronic devices
• MIL-STD-883 Method Number 3024 Simultaneous switching noise measurements for digital microelectronics

Electrical tests (linear):

• MIL-STD-883 Method Number 4001.1 Input offset voltage and current and bias current
• MIL-STD-883 Method Number 4002.1 Phase margin and rotational speed measurements
• MIL-STD-883 Method Number 4003.1 Common-mode input voltage range, Common-mode rejection ratio, Supply voltage rejection ratio
• MIL-STD-883 Method Number 4004.2 Open loop performance
• MIL-STD-883 Method Number 4005.1 Output performance
• MIL-STD-883 Method Number 4006 Power gain and noise figure
• MIL-STD-883 Method Number 4007 Automatic gain control range

Test Procedures:

• MIL-STD-883 Method Number 5001 Parameter mean value check
• MIL-STD-883 Method Number 5002 Parameter distribution control
• MIL-STD-883 Method Number 5003 Failure analysis procedures for microcircuits
• MIL-STD-883 Method Number 5004 Scanning procedures
• MIL-STD-883 Method Number 5005 Qualification and quality compliance procedures
• MIL-STD-883 Method Number 5006 Limit test
• MIL-STD-883 Method Number 5007 Wafer lot acceptance
• MIL-STD-883 Method Number 5008 Test procedures for hybrid and multi-chip microcircuits
• MIL-STD-883 Method Number 5009 Disruptive physical analysis
• MIL-STD-883 Method Number 5010 Test procedures for custom monolithic microcircuits
• MIL-STD-883 Method Number 5011 Evaluation and acceptance procedures for polymeric adhesives
• MIL-STD-883 Method Number 5012 Fault extent measurement for digital microcircuits
• MIL-STD-883 Method Number 5013 Wafer fabrication control and wafer acceptance procedures for machined GaAs wafers

EUROLAB, together with its state-of-the-art accredited laboratories and expert team, helps you get precise and fast results within the scope of MIL-STD-883 Tests.