The ASTM C518 standard covers measuring steady-state thermal conduction through flat plate samples using a heat flow meter apparatus. This test method involves measuring steady-state thermal conduction through flat plate specimens using a heat flow meter apparatus.
The heat flow meter apparatus is widely used because it is relatively simple in concept, fast and applicable to a wide variety of test specimens. The sensitivity and bias of the heat flow meter can be excellent as the calibration is performed within the expected range of heat fluxes. This means that the calibration is performed with similar types of materials, at similar thermal conductivities, at similar thicknesses, average temperatures, and temperature gradients as expected for the test specimens.
This is a comparative or secondary measurement method as samples with known thermal conduction properties will be used to calibrate the instrument. The characteristics of the calibration samples must be traceable to an absolute measurement method. Calibration samples should be obtained from a recognized national standards laboratory.
The heat flow meter apparatus creates a steady state one-dimensional heat flow through a test sample between two parallel plates at constant but different temperatures. By calibrating heat flux transducers in accordance with calibration standards and measuring plate temperatures and plate separation. Fourier's law of heat conduction is used to calculate thermal conductivity and thermal resistance, or thermal resistance and thermal conductivity.
This test method will be used with the C1045 application. Many advances have been made in thermal technology, both in measurement techniques and in a better understanding of the principles of heat flow through materials. These developments have led to revisions in conceptual approaches to the measurement of thermal conduction properties. All users of this testing method should be aware of these concepts.
This test method is applicable to the measurement of thermal conduction through a wide variety of sample properties and environmental conditions. The method has been used at ambient conditions of 250 to 10 °C for thicknesses up to about 40 mm and plate temperatures of 25 mm (5, 6) to -195°C to 540°C. This test method can be used to characterize material properties that may or may not represent actual conditions of use.
The standardization of this test method was developed by research workers or is not designed to limit in any way the future development of new methods or procedures.
This standard is not meant to address all safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to consult and establish appropriate safety and health practices and to determine the applicability of regulatory restrictions prior to use.
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