ASTM F692 Test to Measure Adhesion Strength of Solderable Films to Substrates

ASTM Tests

ASTM F692 Test to Measure Adhesion Strength of Solderable Films to Substrates

EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of ASTM F692 testing. This standard covers the determination of the adhesion strength of films to substrates by drawing wires soldered to the films.

ASTM F692 Test to Measure Adhesion Strength of Solderable Films to Substrates

This test method is designed to measure the adhesion of metallization to substrates, not the strength of the solder.

This test method applies to all solderable films.

The maximum melting point of the solder used with this test method is determined by the properties of the solder flux.

This test method is destructive.

This standard does not purport to address, if any, safety concerns associated with its use. It is the responsibility of the user of this standard to consult and establish appropriate safety and health practices and to determine the applicability of regulatory restrictions prior to use.

EUROLAB assists manufacturers with ASTM F692 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.

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