EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC EN 60068-2-58 test. IEC EN 60068-2-58 summarizes the test Td applicable to surface mount devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys that are eutectic or near-eutectic tin-lead (Pb) or lead-free alloys.
The procedures use a solder bath or reflow method and are only applicable to samples or products designed to withstand brief immersion in molten solder or limited exposure to reflow systems.
The solderbath method applies to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solderbath (immersion) method is appropriate.
The reflow method can be applied to SMD designed for reflow soldering to determine the suitability of SMDs for reflow soldering and where the solderbath (immersion) method is not suitable.
The purpose of this standard is to ensure the solderability of the component lead or termination. In addition, test methods are provided to ensure that the component body can withstand the heat load to which it is subjected during brazing.
EUROLAB assists manufacturers with IEC EN 60068-2-58 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.
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