IEC EN 60068-2-69 Environmental Test - Test Te/Tc - Solderability Test of Electronic Components by Wetting Equilibrium Method

Environmental Tests

IEC EN 60068-2-69 Environmental Test - Test Te/Tc - Solderability Test of Electronic Components by Wetting Equilibrium Method

EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC EN 60068-2-69 test. IEC EN 60068-2-69 summarizes the test Te/Tc, the solderbath wetting balance method, and the solderball wetting balance method for quantitatively determining the solderability of the terminals. The data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.

IEC EN 60068-2-69 Environmental Test - Test Te/Tc - Solderability Test of Electronic Components by Wetting Equilibrium Method

The procedures describe the solderbath wetting balance method and the solderball wetting balance method. They can be applied to metal terminated and metallized solder pad components and printed boards.

The user should note that the test method specified in this standard is intended to provide consistent and discriminatory data across various test sites. Therefore, alloy selection, temperature and flux must be controlled.

The use of this test method to control a manufacturing process is encouraged. However, such test results should be agreed between the user and the supplier, as different alloys, temperatures and flows will be used in each manufacturing process. In case of conflict, the procedures in this document will apply.

The test sample will be a sample from the intended production batch. The test sample is mounted in a suitable holder suspended from a precision balance. The liquid flux is then applied to the sample, which is brought into contact with the cleaned surface of the liquid solder or the apex of a solder ball in a solder bath. In both cases the solder is at a controlled temperature and the lead or termination being tested is dipped to the prescribed depth.

The test sample should be a representative test sample, part of the printed circuit board being tested, or, if within size limits, the entire sheet, such that an immersion depth defined in the individual method is possible. The test specimens can be used for rigid board surface solderability and for through-hole solderability.

EUROLAB assists manufacturers with IEC EN 60068-2-69 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.

Get Offer Now

To get an appointment, to get more detailed information or to request an evaluation, you can ask us to fill in our form and reach you.

WhatsApp