IEC 61189-5-501 Electrical Equipment, Printed Panels and Other Interconnection Structures and Assemblies, Surface Insulation Resistance Test of Solder Fluxes

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IEC 61189-5-501 Electrical Equipment, Printed Panels and Other Interconnection Structures and Assemblies, Surface Insulation Resistance Test of Solder Fluxes

EUROLAB laboratory provides testing and compliance services within the scope of the IEC 61189-5-501 standard. IEC 61189-5-501 is used to measure the detrimental effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

IEC 61189-5-501 Electrical Equipment, Printed Panels and Other Interconnection Structures and Assemblies, Surface Insulation Resistance Test of Solder Fluxes

For evaluation, interdigital comb patterns with long parallel electrodes on an IPC B53 standardized test coupon are used. Coupons are conditioned and measurements are taken at high temperature and humidity.

It has been the practice of using different test coupons that has caused confusion in comparing test results. Additionally, previous revisions of this and other test methods have conflicting requirements in terms of voltage gradient and test voltages to be used.

Specifically, this method is designed to simultaneously evaluate:

  • Leakage current caused by ionized water films and electrochemical degradation of the test medium (corrosion, dendritic growth);
  • Provide metrics that can be appropriately used for binary classification (eg attendance/no; pass/fail);
  • To compare, rank or characterize materials and processes.

EUROLAB assists manufacturers with IEC 61189-5-501 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.

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