EN IEC 60068-2-10 Basic Environmental Test Procedures for Electronic Components and Electronic Equipment - Part 2: Tests - Test J: Mold Growth

Electric Electronic Tests

EN IEC 60068-2-10 Basic Environmental Test Procedures for Electronic Components and Electronic Equipment - Part 2: Tests - Test J: Mold Growth

This section of EN IEC 60068-2-10 provides a test method for determining the extent to which electrotechnical products support mold growth and how any mold growth may affect the product's performance and other related properties.

EN IEC 60068-2-10 Basic Environmental Test Procedures for Electronic Components and Electronic Equipment - Part 2: Tests - Test J: Mold Growth

Because mold growth conditions involve high relative humidity, the test is applicable to electrotechnical products intended for transport, storage and use under humid conditions for at least a few days.

The main changes related to the previous version are listed below:

  • Two test mushrooms were exchanged by two others,
  • The concentration of spores identified for each test fungus,
  • Spore suspension in mineral salt solution is additionally introduced,
  • The preconditioning of the samples was explained by the prescribed moist heat storage,
  • Supersonic aerosolization of spore suspension as the preferred method of inoculation,
  • Incubation period reduced from 84 days to 56 days,
  • The scope of mold growth grade 2 is divided into class 2a and class 2b.

The EN IEC 84-28-01 test is used to assess the extent of mold growth with a short exposure of 60068 days 2 to assess the effect of mold growth on the functioning of the sample with a longer exposure of 10 days.

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