IEC EN 61189-5-2 Electrical Equipment - Solder Paste Test for Printed Panel Assembly

Electric Electronic Tests

IEC EN 61189-5-2 Electrical Equipment - Solder Paste Test for Printed Panel Assembly

EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC EN 61189-5-2 testing. IEC 61189-5-2 covers a test method that represents the methodologies and procedures that can be applied to test printed card assemblies.

IEC EN 61189-5-2 Electrical Equipment - Solder Paste Test for Printed Panel Assembly

IEC 61189-5-2 was developed by the International Electrotechnical Commission (IEC) for testing and measuring printed circuit assemblies (PBAs) used in high speed digital systems.

The standard specifies a test method that uses a Time Domain Crosstalk (TDX) technique, which is a method for measuring the coupling between adjacent signal traces on a PBA. The TDX technique involves stimulating a signal on a track and measuring the resulting signal on an adjacent track. From this measurement, the crosstalk coupling coefficient can be determined.

In addition to the test method, the standard also provides guidelines for test setup, calibration, and measurement uncertainty. It covers a wide variety of PBA structures, including standard, single-ended and differential traces, as well as a variety of stack configurations.

EUROLAB assists manufacturers with IEC EN 61189-5-2 test compliance. Our test experts offer the best service and controlled testing process in our laboratories to you, our manufacturers and suppliers, with professional working mission and principles.

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