IEC 60068-2-54 Solderability Test of Electronic Components by Wet Balance Method

Electric Electronic Tests

IEC 60068-2-54 Solderability Test of Electronic Components by Wet Balance Method

EUROLAB, together with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC 60068-2-54 testing. This standard outlines Test Ta, a solderbath wetting balance method applicable to any form of component termination to determine solderability.

IEC 60068-2-54 Solderability Test of Electronic Components by Wet Balance Method

It is particularly suitable for components that cannot be quantitatively tested by reference tests and other methods. If suitable for surface mount devices (SMD), IEC 60068-2-69 should be applied.

This standard provides standard procedures for lead (Pb)-containing solder alloys and lead-free solder alloys.

EUROLAB assists manufacturers with IEC 60068-2-54 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.

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