EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC EN 61189-5-3 testing. IEC 61189-5-3 is a standard developed by the International Electrotechnical Commission (IEC) for testing soldering flux used in the assembly of printed circuit boards (PCBs).
The standard provides a method for measuring the activity level of the soldering flux. The standard specifies a test method using the Copper Mirror (CM) technique, a method for measuring the activity level of flux.
The CM technique involves dipping a clean copper strip into a flux-containing solution and then heating the strip until a thin layer of copper oxide forms on the surface. Next, the amount of oxide formation, which is indicative of the activity level of the flux, is measured.
The activity level of the soldering flux affects the quality and reliability of the solder joints, and testing the flux can help ensure the final product meets the required standards.
EUROLAB assists manufacturers with IEC EN 61189-5-3 test compliance. Our test experts offer the best service and controlled testing process in our laboratories to you, our manufacturers and suppliers, with professional working mission and principles.
To get an appointment, to get more detailed information or to request an evaluation, you can ask us to fill in our form and reach you.
EUROLABreporting and certification activities, United Accreditation Foundation (UAF), Turkish Accreditation Agency (TÜRKAK) ve Enterprise Accreditation Foundation (EAF) based on the accreditation provided by the accreditation body. The Enterprise Accreditation Foundation (EAF) accreditation body is also a signatory of the United Nations (UN GLOBAL COMPACT) organization.
