EUROLAB laboratory provides testing and compliance services within the scope of IEC 61189-5-601 standard. IEC 61189-5-601 specifies the reflow soldering ability test method for components mounted on organic rigid printed sheets, the reflow heat resistance test method for organic rigid printed sheets, and the reflow soldering ability test method for organic rigid printed sheets.
Covers plates in applications where solder alloys are eutectic or near-eutectic tin-lead (Pb) or lead-free alloys.
Printed sheet materials for these organic rigid printed sheets are epoxide woven E-glass laminated sheets specified in IEC 61249-2 (all parts).
The purpose of this standard is to ensure the solderability of the solder joint and the surfaces of printed boards. In addition, test methods are provided to ensure that the printed plates can withstand the heat load to which they are subjected during soldering.
EUROLAB assists manufacturers with IEC 61189-5-601 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.
To get an appointment, to get more detailed information or to request an evaluation, you can ask us to fill in our form and reach you.
EUROLABreporting and certification activities, United Accreditation Foundation (UAF), Turkish Accreditation Agency (TÜRKAK) ve Enterprise Accreditation Foundation (EAF) based on the accreditation provided by the accreditation body. The Enterprise Accreditation Foundation (EAF) accreditation body is also a signatory of the United Nations (UN GLOBAL COMPACT) organization.
