Solder Joint Reliability Test

Solder joint reliability is defined as the ability of your product to operate solder joints under certain conditions and over a period of time without exceeding acceptable failure levels.

Whether you are trying to apply a new solder type or new component types, the solder joint reliability test is important in providing confidence that your product will perform within its intended operating limits. Results from different test programs can be compared to ensure understanding of design requirements for adequate reliability. This saves you time and money by providing you with useful technical information for future designs.

Thermal Loop is the most common method of testing Solder Joint Reliability. Common test features include:

1) JEDEC Standard JESD22-A104 Thermal Loop or

2) Performance Test Methods and Qualification Requirements for IPC 9701 Surface Solder Attachments

The Thermal Cycle is usually performed at a transition rate of usually less than or equal to 1C per minute (usually 3 to 20C per minute) to prevent thermal shock with 10-14 cycles per hour. According to IPC-9701, extreme temperatures are based on the category of low temperature products, usually below 25C, of ​​the glass transition temperature (Tg) of the printed circuit board material.

The electrical resistance is constantly monitored during testing using data loggers. Typically, the fault definition will be an increase of 20% above the nominal resistance. The test is continued until 63% of the errors occur to characterize the error distribution. Fault analysis (sections, SEM / EDS, X-RAY, paint and surveillance etc.) is used to find the location and type of the fault after the fault detection.

Other Solder Common Reliability Test Methods may include:

• Thermal shock
• Power Cycle
• DUR
• Mechanical Shock Test
• Vibration Test
• High Temperature Storage Test