The emergence of surface mounted devices (SMDs) has revealed a new class of quality and reliability concerns related to package damage "cracks and delamination" caused by soldering reflow. This document describes the standard Moisture Sensitivity Levels (MSL) of exposure to floor life for moisture or reflow sensitive SMD packages, and the handling, packaging, and shipping requirements required to prevent moisture or reflow related failures. Supplementary documents J-STD-020D.1 and JEP113 define the classification procedure and labeling requirements, respectively.
Moisture from atmospheric moisture enters the permeable packaging materials through diffusion. Assembly operations used to solder SMD packages to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 ° C. During solder reflow, the combination of rapid moisture expansion, material mismatch, and material interface degradation can cause cracking of the pack or delamination of critical interfaces within the pack.
Relevant soldering reflow processes are convection, convection / IR, infrared (IR), vapor phase (VPR) and hot air processing tools. Using assembly processes that immerse the component body in molten solder is not recommended for most SMD packages.
This JEDEC test defines the classification level of moisture-dependent stress-sensitive non-hermetic solid state surface mounting devices (SMDs). Used to determine which classification level should be used for the initial reliability qualification.
Once defined, SMDs can be properly packaged, stored and processed to prevent subsequent thermal and mechanical damage during assembly soldering reflow attachment or repair. This D revision now includes components to be processed at higher temperatures for lead-free assembly.
You can contact our expert team to get detailed information about moisture resistance test and to talk about your questions and problems.
To get an appointment, to get more detailed information or to request an evaluation, you can ask us to fill in our form and reach you.
EUROLABreporting and certification activities, United Accreditation Foundation (UAF), Turkish Accreditation Agency (TÜRKAK) ve Enterprise Accreditation Foundation (EAF) based on the accreditation provided by the accreditation body. The Enterprise Accreditation Foundation (EAF) accreditation body is also a signatory of the United Nations (UN GLOBAL COMPACT) organization.
