Destructive Physical Analysis (DPA) is the process of removing, testing and inspecting electronic components to verify interior design, materials, construction and workmanship. This sample inspection process is used to help manufacture electronic components to the required standards. Destructive Physical Analysis is also used effectively to find process defects to identify plant problems.
The component analysis lab in EUROLAB performs important analytical functions such as Destructive Physical Analysis (DPA), Error Analysis (FA), Fake Analysis and material analysis on electronic components. Our DPA techniques are performed in accordance with industry standards and methods used in most military and space program requirements. Solutions for production challenges can be resolved through our error analysis procedures and verification.
Different operations are performed as part of our Destructive Physical Analysis (DPA) process, from removal of the encapsulant to post-sectional internal visual examinations. Our standard DPA program is External Visual Inspection (EVI), Hermeticity Test, Acoustic Microscopy, Decapsulation / Delidding, Internal Visual Inspection, Bond Tensile Test, Die Cutting Test, Scanning Electron Microscopy / Energy Distributor X-Ray Spectroscopy (SEM / EDS), X- Includes Ray Radiography, X-Ray Fluorescence (XRF), Microsection (cross section) Analysis and Optical Microscopy testing and analysis.
DPA is most commonly performed on MIL-STD-1580 using the following test methods:
eurolab, Destructive Physical Analysis He is extremely experienced in preparing and is very knowledgeable in DPA procedures. In addition to the sampling of the MIL-STD test methods listed above, EUROLAB can perform customer-specified DPA test flows through a customer's selection of MIL-STD test procedures or a complete DPA to meet a customer's own supply document.
DPA, Scanning Electronic Microscope (SEM), X-Ray Fluorescence (XRF), Energy Distributor X-ray Spectrometry (EDS) and C-mode Scan Acoustic Microscopy (CSAM) are used to perform in-depth breakdowns and materials.
Counterfeit Component Test Our group includes industry experts working to develop the industry's first standard of test methods to provide uniform requirements, practices, and methods for testing electronic components to reduce the risk of buying or using suspected counterfeit electronic parts.
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EUROLABreporting and certification activities, United Accreditation Foundation (UAF), Turkish Accreditation Agency (TÜRKAK) ve Enterprise Accreditation Foundation (EAF) based on the accreditation provided by the accreditation body. The Enterprise Accreditation Foundation (EAF) accreditation body is also a signatory of the United Nations (UN GLOBAL COMPACT) organization.
