IEC EN 61191-2 Printed Panel Assemblies - Part 2: Section Specification - Requirements for Surface Mount Brazed Assemblies

Electromagnetic and Electrical Tests

IEC EN 61191-2 Printed Panel Assemblies - Part 2: Section Specification - Requirements for Surface Mount Brazed Assemblies

EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC EN 61191-2 testing. IEC EN 61191-2 gives requirements for surface mounted solder joints. Requirements relate to purely surface mounted assemblies or surface mounted portions of these assemblies incorporating other related technologies (eg through hole, chip mount, terminal mount, etc.).

IEC EN 61191-2 Printed Panel Assemblies - Part 2: Section Specification - Requirements for Surface Mount Brazed Assemblies

This edition includes the following important technical changes from the previous edition:

  • The requirements have been updated to comply with the acceptance criteria in IPC‑A-610F;
  • Some terminology used in the document has been updated;
  • References to IEC standards have been corrected;
  • Added five finishing styles.

This clause covers the assembly of surface-mounted components to be soldered by hand or machine and includes components designed for surface mounting as well as through-hole components adapted for surface mounting technology.

The ends of lead surface mount components must be shaped to their final configuration prior to assembly. Leads must be formed so that they can be soldered into place by subsequent processing so that the lead-body seal is not damaged or deteriorated and does not cause residual stresses that reduce reliability. When the ends of double-row packs, flat packs, and other multi-end devices are misaligned during processing or transport, they can be flattened to ensure parallelism and alignment prior to assembly while maintaining lead-to-stem sealed integrity.

Guides on opposite sides of surface mounted flat packs should be formed so that parallelism between the base surface of the component and the surface of the printed circuit board (ie component slope) is minimal. Component inclination is allowed provided the final configuration does not exceed the maximum clearance limit of 2,0 mm.

EUROLAB assists manufacturers with IEC EN 61191-2 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.

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