IEC EN 61191-6 Printed Panel Assemblies - Part 6: Evaluation Criteria and Measurement Method for Gaps in BGA and LGA Soldered Connections

Electromagnetic and Electrical Tests

IEC EN 61191-6 Printed Panel Assemblies - Part 6: Evaluation Criteria and Measurement Method for Gaps in BGA and LGA Soldered Connections

EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of IEC EN 61191-6 testing. IEC EN 61191-6 specifies evaluation criteria for voids on the thermal cycle life scale and a method of measuring voids using X-ray observation. This part of IEC EN 61191 is applicable to gaps in solder joints of BGA and LGA soldered onto a board. This part of IEC 61191 cannot be applied to the BGA package itself before it is mounted on the switchboard.

IEC EN 61191-6 Printed Panel Assemblies - Part 6: Evaluation Criteria and Measurement Method for Gaps in BGA and LGA Soldered Connections

In addition to BGA and LGA, this standard also applies to devices with connections made by melting and resolidification, such as flip chip devices and multi-chip modules. This standard does not apply to underfilled connections between a device and a board, or to soldered joints within a device package.

This standard is applicable to large gaps from 10 µm to several hundred micrometers that occur in a soldered joint. however, it does not apply to smaller voids (typically planar micro-voids) less than 10 µm in diameter. This standard is for evaluation purposes and applies to research studies, off-line production process control and reliability evaluation of assembly.

This standard is for evaluation purposes and applies to:

  • Research studies;
  • Offline production process control;
  • Reliability assessment of the assembly.

A change in gap size or gap frequency may be an indication that fabrication parameters need to be adjusted. Two reported causes of cavities are trapped flux that has not had enough time to be released from the solder paste and contaminants on improperly cleaned circuit boards. The voids appear as a lighter colored area in the X-ray picture of the solder joints and are often found randomly throughout the package.

EUROLAB assists manufacturers with IEC EN 61191-6 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.

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