GOST R50109-92 Non-Metallic Materials - Test Method for Mass Loss and Content of Volatile - Condensable Materials in Vacuum-Thermal Environment

EUROLAB, with its state-of-the-art accredited laboratories and expert team, provides precise and fast testing services within the scope of GOST R50109-92 test. It relates to versions of high bond strength, heat conductive cold curing epoxy adhesive compositions designed to bond metals (steels, aluminum and titanium alloys), ceramics, carbon fiber and facilitate heat removal from heated structural components.

The heat-conducting adhesive compound is designed to remove heat from heated structural elements to instrument panels to maintain certain thermal operating conditions of onboard equipment in aerospace equipment. Therefore, said adhesive should provide the technical result.

It is characterized by curing at the temperature of the production facility (25±10°C) and minimal gaseous emission under vacuum-heat action according to GOST R50109-92. The composition of the heat-conducting adhesive compound includes an epoxy dian resin, an aliphatic amine, a low molecular weight polyamide resin and a heat-conducting filler, boron nitride, and also includes triglycidyl ether of trimethylolpropane and diglycidyl ether.

EUROLAB assists manufacturers with GOST R50109-92 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.