The wetting balance test is used to measure the wetting forces between the molten solder and the test surfaces as a function of time. The solderable surface differs in adhesion speed and strength. The wetting balance measures the time of soldering component termination or pad wetting.
Solderability is determined by thermal demand and wettability of the surface. Wettability is affected by metal or contaminants on the surface. It is often used to test counterfeit parts, as resurfaced leads react differently than new parts.
The wetting balance test can be performed on leaded or lead-free components. Leaded components use a molten solder bath and a spherical solder is used for lead-free parts instead of a solder bath.
Many specifications require some kind of preconditioning, such as the vapor age, before testing. The prerequisite mimics shelf life to show solderability and wettability after long storage times.
Some features and methods for Soak Balance Test: ANSI J-STD-002, ANSI J-STD-003, MIL-STD 883, ISO 9455-16, ISO 12224-3 and JIS Z 3198.
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