Scanning Acoustic Microscopy, also known as C-SAM or Acoustic Micro Imaging, or AMI, is its ability to find hidden flaws in assemblies and materials that may occur during manufacturing or environmental testing. Defects such as delaminations, voids and cracks can be identified and analyzed more effectively than other examination methods using Acoustic Microscopy.
Unlike other non-destructive techniques such as Acoustic Microscopy, X-Ray and Infrared Imaging, it is highly sensitive to the elastic properties of the materials it passes through. Therefore, the ability of Acoustic Microscopy to find and characterize these physical defects is clearly superior. Typical applications include production control, failure analysis, and product development.
With the use of ultra high frequency ultrasound, C-SAM finds and characterizes non-destructive physical defects such as cracks, voids, delaminations and porosity that occur during production, environmental testing and even normal component operation. Due to the unique aspects of the technology, AMI may find these errors better than other inspection methods.
C-SAM and X-ray are complementary techniques commonly found in laboratories, but they exhibit different properties. If the X-ray is based on the differential attenuation of the X-ray energy, the AMI is based on the material change. The practical result is that AMI has more precise order of magnitude for detecting airspace type defects, such as voids, delaminations and cracks.
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