IEC 62137-1-1 Surface Mount Technology, Environmental and Durability for Surface Mount Solder Connection, Part 1-1: Tensile Strength Testing

EUROLAB laboratory provides testing and compliance services within the scope of IEC 62137-1-1 standard. The test method described in IEC 62137-1-1 is applicable to gull-wing lead surface mount components.

The method is designed to test and evaluate the durability of the solder joint between the component leads and the landings on a substrate by means of a pull-type mechanical stress.

This test is suitable for evaluating the effects of repeated temperature variation on the strength of the solder joint between component terminals and grounds on a substrate.

The mechanical properties of the connection between the leads to ground on a printed circuit board using lead-free solder are not the same for the connection using tin-lead solder due to the difference in the compositional elements of the solders. Therefore, it becomes important to test the mechanical properties of solder joints using different solder alloys and after temperature cycling stress has been applied.

In this test method, test specimens are mounted on a substrate by either flow soldering or reflow soldering. The durability of the soldered joints is evaluated by first exposing the electronic components to rapid temperature changes and then applying a tensile force to the soldered joint.

EUROLAB assists manufacturers with IEC 62137-1-1 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.