IPC-TM-650 2.6.27 User Manual, Standard Test for Thermal Stress, Convection Reflow Assembly Simulation

EUROLAB laboratory provides testing and compliance services within the scope of IPC-TM-650 2.6.27 test standard. The purpose of this standard is to assist users of IPC-TM-650, Method 2.6.27, “Thermal Voltage, Convection Reflow Assembly Simulation”.

The reason for this test method is that IPC-TM-650, method 2.6.8, thermal stress, coated holes (thermal stress with solder float) are no longer considered sufficient to simulate the assembly process, and stresses that many products are currently experiencing.

For many years the assembly process continued to diverge from wave soldering with the addition of top and then bottom surface mount devices. In summary, adding more and more cycles of method 2.6.8 solder float was not doing an acceptable job of scanning printed boards that failed during assembly due to the very different thermal stresses encountered.

This standard was developed by the IPC D-650 Thermal Stress Test Method Subcommittee, which developed IPC-TM-2.6.27, method 32, with the understanding that the test method will require specialized equipment and proper setup and calibration of that equipment.

EUROLAB assists manufacturers with IPC-TM-650 2.6.27 test compliance. Our test experts, with their professional working mission and principles, provide you, our manufacturers and suppliers, the best service and controlled testing process in our laboratories. Thanks to these services, businesses receive more effective, high-performance and quality testing services and provide safe, fast and uninterrupted service to their customers.